Wafer structure and trimming method thereof

ABSTRACT

A wafer structure and a trimming method thereof are provided. The trimming method includes the following steps. A first wafer having a first surface and a second surface opposite to the first surface is provided. A first pre-trimming mark is formed on the first surface of the first wafer, where forming the first pre-trimming mark includes forming a plurality of recesses arranged as a path along a periphery of the first wafer. The first wafer is trimmed on the first pre-trimming mark and along the path of the first pre-trimming mark to remove a portion of the first wafer and form a trimmed edge having first regions thereon.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional application of U.S. patent applicationSer. No. 16/170,039, filed on Oct. 25, 2018, now allowed, and claims thepriority benefit of U.S. provisional application Ser. No. 62/584,924,filed on Nov. 13, 2017. The entirety of the above-mentioned patentapplications is hereby incorporated by reference herein and made a partof this specification.

BACKGROUND

In recent years, owing to the need in miniaturizing the semiconductorchips, the requirements of wafer thinning process become more severe insemiconductor manufacturing process. Generally, during the waferthinning process, the grinding process performed on the backside of thesemiconductor wafer may cause the wafer edge to be damaged.Subsequently, an edge trimming process may be performed to remove theouter edge of the wafer.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1A through FIG. 1H illustrate schematic cross-sectional views of atrimming method of a stacked wafer structure, in accordance with someembodiments of the present disclosure.

FIG. 2A illustrates a schematic top view of a first wafer after forminga first pre-trimming mark, in accordance with some embodiments of thepresent disclosure.

FIG. 2B and FIG. 2C illustrate schematic perspective views of amarking-trimming process of a first wafer, in accordance with someembodiments.

FIG. 2D illustrates a schematic enlarged cross-sectional view of an edgesurface in the area A shown in FIG. 2C, in accordance with someembodiments of the present disclosure.

FIG. 3A illustrates a schematic top view of a stacked wafer structureafter forming a second pre-trimming mark, in accordance with someembodiments of the present disclosure.

FIG. 3B and FIG. 3C illustrate schematic perspective views of amarking-trimming process of a first wafer and a second wafer, inaccordance with some embodiments of the present disclosure.

FIG. 3D illustrates a schematic enlarged cross-sectional view of an edgesurface in the area D shown in FIG. 3C, in accordance with someembodiments of the present disclosure.

FIG. 4A illustrates a schematic enlarged cross-sectional view of thearea B indicated in FIG. 1F before performing the second trimming step,in accordance with some embodiments of the present disclosure.

FIG. 4B illustrates a schematic enlarged cross-sectional view of thearea C indicated in FIG. 1H, in accordance with some embodiments of thepresent disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

FIG. 1A through FIG. 1H illustrate schematic cross-sectional views of atrimming method of a stacked wafer structure, in accordance with someembodiments of the present disclosure. Referring to FIG. 1A, a firstwafer 100 is provided. In some embodiments, the first wafer 100 has afirst surface 102, a second surface 104 opposite to the first surface102, and an edge 106 connecting between the first surface 102 and thesecond surface 104. For example, a side where the first surface 102 islocated may be referred to the front side of the first wafer 100, andthe opposite side where the second surface 104 is located may bereferred to the backside of the first wafer 100. The first wafer 100 maybe of any appropriate size and shape. In some embodiments, the firstwafer 100 is a substantially circular wafer. The edge 106 in FIG. 1A isillustrated as curve shaped or a rounded edge. In other embodiments, thefirst wafer 100 may have a chamfered edge or a beveled edge.

In some embodiments, the first wafer 100 may be a semiconductor wafersuch as a silicon bulk wafer or a gallium arsenide wafer. In someembodiments, the first wafer 100 may include, for example, silicon,strained silicon, silicon alloy, silicon carbide, silicon-germanium,silicon-germanium carbide, germanium, a germanium alloy,germanium-arsenic, indium-arsenic, group III-V semiconductors. In someembodiments, the first wafer 100 is a device wafer. In some embodiments,the first wafer 100 includes a plurality of devices 112 may be formed atthe first surface 102 of the first wafer 100. The devices 112 may be,for example, light sensing devices or image sensors capable ofconverting light to electrical signals formed and located at the frontside of the first wafer 100. In certain embodiments, the devices 112 mayinclude, for example, photo diodes (PD), photo transistors, or acombination thereof. In some embodiments, the devices 112 may include,for example, CMOS image sensors (CIS) or charge-coupled device (CCD)sensors. The devices 112 are located relatively distanced from the edge106 (the periphery of the first wafer 100) such that the followingtrimming processes may be carried out without damaging the devices 112.In some embodiments, additional semiconductor devices or electricalcomponents with different functions or integrated circuits may also beincluded in the first wafer 100. In some embodiments, interconnectstructures (not illustrated) may be formed over the first wafer 100 andbe electrically coupled with the devices 112 and/or other electricalcomponents. The scope of the disclosure is not limited to theembodiments or drawings described therein.

After providing the first wafer 100, a first marking-trimming step isperformed. FIG. 2A illustrates a schematic top view of a first waferafter forming a first pre-trimming mark, in accordance with someembodiments of the present disclosure. FIG. 2B and FIG. 2C illustrateschematic perspective views of a marking-trimming process of a firstwafer, in accordance with some embodiments of the present disclosure.FIG. 2D illustrates a schematic enlarged cross-sectional view of an edgesurface in the area A shown in FIG. 2C, in accordance with someembodiments of the present disclosure. Referring to FIG. 2A through FIG.2C, in some embodiments, the first wafer 100 may be a round-shaped waferand a first pre-trimming mark 50 is formed on the first surface 102 ofthe first wafer 100 to define an annular ring TR1. In certainembodiments, the annular ring TR1 defined between the first pre-trimmingmark 50 and the edge 106 of the first wafer 100 (i.e. the periphery ofthe first wafer 100) has a first width Pw1. In some embodiments, thefirst pre-trimming mark 50 may be formed as a discontinuous pattern oran intermittent pattern on the first surface 102. In some embodiments,the first pre-trimming mark 50 includes a plurality of recesses 50 a,and the recesses 50 a are individual narrow trenches separate from oneanother. For example, the recesses 50 a is arranged as a circular pathalong the periphery of the first wafer 100 to form the firstpre-trimming mark 50.

In some embodiments, the recesses 50 a are formed by etching, forexample, wet etching, or dry etching. In certain embodiments, therecesses 50 a are formed by laser marking or other suitable markingprocess. Each recess 50 a may include a marking depth d1 relative to areference plane corresponding to the first surface 102 of the firstwafer 100. The marking depth d1 of each recess 50 a shown in FIG. 2B mayrange from 10 μm to 150 μm, preferably from 80 μm to 120 μm. It shouldbe noted that the marking depth d1 may be varied depending on thetrimming depth of the wafer in the subsequent trimming step. It isappreciated that the number of the recesses 50 a, the shape or the sizeof the recesses 50 a, and the arrangement of the recesses 50 a may bemodified according to the design requirements of the product. In someembodiments, the intermittent pattern of the first pre-trimming mark 50may include individual recesses 50 a separated with one another andspaced by a fixed pitch. In some embodiments, any two most adjacentrecesses 50 a are spaced by a pitch P1. For example, the pitch P1between the two most adjacent recesses 50 a may range from 5 μm to 100μm, preferably from 8 μm to 40 μm. In some embodiments, a sum of thepitches P1 along the circular path may be approximately half of a totallength of the circular path. For example, the recesses 50 a may beevenly distributed on the first surface 102 as a circular path along theperiphery of the first wafer 100. It should be noted that the pitch P1may be modified according to the dimension of the wafer and the designrequirements. In some other embodiments, a ratio of the sum of thepitches P1 along the circular path to the total length of the circularpath of the first pre-trimming mark 50 ranges from 30% to 80%. Inalternative embodiments, the pattern of the first pre-trimming mark 50may be sporadic. In other embodiments, the pattern includes individualrecesses 50 a separated with one another and spaced with variouspitches.

After forming the first pre-trimming mark 50, a first trimming step isperformed. The processes illustrated in FIG. 2A through FIG. 2C may bereferred to as the first marking-trimming step. For example, the annularring TR1 around the periphery of the first wafer 100 is removed from thefirst wafer 100 by performing the first trimming step along the firstpre-trimming mark 50 as shown in FIGS. 2B-2C and FIG. 1B. In someembodiments, the first trimming step includes cutting or trimming off aportion of the first wafer 100 by mechanical machining from the firstsurface 102 vertically downward (i.e. towards the second surface 104 butnot cutting through) along the thickness direction D1 to form thetrimmed edge 106 a near the periphery of the first wafer 100 as shown inFIG. 2C and FIG. 1B. In some embodiments, the first trimming step isperformed by a trimming tool 60 cutting substantially vertically orslantedly into the first wafer 100 to a trimming depth Pt1. In certainembodiments, during the first trimming step, the first wafer 100 is cutright on the first pre-trimming mark 50 and the first pre-trimming mark50 is cut through, leading to a trimming depth Pt1 larger than themarking depth d1 of the recesses 50 a of the first pre-trimming mark 50.In some embodiments, the trimming tool includes a scribing wheel or atrimming blade wheel. Alternatively, the first trimming step isperformed through any other suitable tools capable of mechanicallycutting away the material of the wafer structure, and the scope of thedisclosure is not limited thereto. For example, during the firsttrimming step, the trimming tool 60 rotates and moves along the circularpath of the first pre-trimming mark 50 for wafer-edge trimming. In someembodiments, as the first wafer is cut or trimmed on the firstpre-trimming mark 50 and along the path of the first pre-trimming mark50, the path of the first pre-trimming mark 50 (e.g. the circular pathas shown in FIG. 2B) functions as the trimming path. Since the trimmingtool 60 is moved along the circular path formed by the recesses 50 a,the direct contact between the trimming tool 60 and the first wafer 100is reduced along the trimming path, thereby reducing localized stressconcentration at the first surface 102 and easing chip cracking inducedby the stress. Accordingly, the production yield is significantlyimproved. In addition, the operation efficiency of trimming is improvedand the service life of the trimming tool 60 is lengthened as theshorter cutting distance or path reduces the damage of the trimming tool60.

In some embodiments, after the first trimming step, the annular ring TR1is removed to form a ring-shaped opening O1 at the periphery of thefirst wafer 100 as shown in FIG. 2C. During the first marking-trimmingstep, the removed annular ring TR1 may have the first width Pw1 (asdefined by the first pre-trimming mark 50) and the thickness Pt1 (thetrimming depth Pt1). Referring to FIG. 1B, from a cross-sectional view,the ring-shaped opening O1 looks like L-shaped and the sidewall of thering-shaped opening O1 is the trimmed edge 106 a. In some embodiments,the trimmed edge 106 a is substantially perpendicular to the firstsurface 102. In some embodiments, the trimmed edge 106 a is slant to thefirst surface 102.

In some embodiments, the first thickness Pt1 (i.e. the trimming depthPt1) is measured from the bottom surface 103 (shown in FIG. 1B) of theopening O1 to a reference plane extending from the first surface 102. Insome embodiments, the first width Pw1 is measured from the trimmed edge106 a to a reference plane extending from the edge 106. In someembodiments, the first wafer 100 is a silicon wafer having a diameter ofabout 12-inch (about 300 mm). In such embodiments, the trimming depthPt1 ranges from about 50 microns to about 150 microns or is about 100microns. In such embodiments, the first width Pw1 ranges from about 0.8mm to about 1.5 mm or is about 1.2 mm. It is appreciated that the firstthickness Pt1 and the first width Pw1 may be modified depending on thedimension of the wafer and the design requirements of the product, whichis not limited thereto.

Referring to FIG. 2D, after performing the first marking-trimming step,the sidewall surface of the trimmed edge 106 a (e.g. the area Aindicated in FIG. 2C and FIG. 2D) may have a plurality of first regionsR1 surrounding by a second region R2. In some embodiments, the firstregions R1 are formed from the recesses 50 a (FIG. 2B) cutting throughduring the trimming step. That is, the first regions R1 are cut-throughrecesses. The individual first regions R1 may be separated with oneanother and are spaced from one another by the second region R2surrounding them. In some embodiments, the texture feature TF1 of thefirst regions R1 is different from the texture feature TF2 of the secondregion R2. In some embodiments, the first region R1 includes etchingstreaks as the texture feature TF1 when recesses 50 a are formed byetching. In some embodiments, the first region R1 includes laser markingstreaks as the texture feature TF1 when the recesses 50 a are formed bylaser marking. For example, the etching streaks Es may be presented asfine straight lines extending in the thickness direction D1 in the firstregions R1 as shown in the enlarged view in the upper part of FIG. 2D.In some embodiments, as shown in the enlarged view in the lower part ofFIG. 2D, the texture feature TF2 of the second region R2 includesfracture texture presented in the second region R2 as a main crackportion C1 and a median crack portion C2 below the main crack portionC1. For example, a thickness of the main crack portion C1 may be smallerthan a thickness of the median crack portion C2. As the pre-trimmingmark is formed prior to the trimming step, a smaller main crack portionC1 is formed due to the less localized stress concentration. It isappreciated that the thickness and the profile of the median crackportion C2 depends on the types of the trimming tool used. In someembodiments, the microscopic fractures W1 (also known as Wallner lines)may be formed on the surface in the median crack portion C2 of thesecond region R2, and the microscopic fractures may exhibit as evenlydistributed and substantially parallel curves extending with respect tothe thickness direction without irregular lateral cracks.

Referring to FIG. 1C, a second wafer 200 having a top surface 202, abottom surface 204 opposite to the top surface 202 and an edge 206connected between the top surface 202 and the bottom surface 204 isprovided. For example, the second wafer 200 is a semiconductor wafer andfunctions as a carrier wafer herein. In some embodiments, the secondwafer 200 may include, for example, silicon, strained silicon, siliconalloy, silicon carbide, silicon-germanium, silicon-germanium carbide,germanium, a germanium alloy, germanium-arsenic, indium-arsenic, groupIII-V semiconductors. In some embodiments, the second wafer 200 includesglass or ceramic materials. After performing the first marking-trimmingstep, the first wafer 100 and the second wafer 200 are bonded to eachother to form a stacked wafer structure 300. In some embodiments, thefirst wafer 100 and the second wafer 200 have the same diameter. Inother embodiments, the first wafer 100 and the second wafer 200 may havedifferent diameters. The dimension of the first wafer 100 and the secondwafer 200 may depend on the design requirement and construe nolimitation in the disclosure. When bonding the first wafer 100 and thesecond wafer 200, the molecular bonding technique may be employed. Forexample, bringing the first surface 102 of the first wafer 100 and thetop surface 202 of the second wafer 200 into direct contact, and thefirst wafer 100 and the second wafer 200 are bonded through Van derWaals force without using a specific bonding material or an adhesive.

It should be noted that the molecular bonding technique may require thesurfaces of the first wafer 100 and the second wafer 200 to be bondedare smooth and also free from particles or contamination. Before bondingthe first wafer 100 and the second wafer 200, the first surface 102 ofthe first wafer 100 and/or the top surface 202 of the second wafer 200may be treated by a cleaning process to remove particles thereon. Aftercleaning, the first wafer 100 and the second wafer 200 are placedsufficiently close together for contact to be initiated. Under suchcircumstances, a force of attraction between the first surface 102 ofthe first wafer 100 and the top surface 202 of the second wafer 200 ishigh enough to cause molecular bonding induced by the Van der Waalsforce.

In some embodiments, in FIG. 1C, after bonding the first wafer 100 andthe second wafer 200, an annealing process may be performed tostrengthen the bonding between the first wafer 100 and the second wafer200. The temperature of the annealing process may depend on the designrequirement. For example, the higher the temperature of the annealingprocess, the greater the resulting bonding strength. In otherembodiments in which the electrical components are distributed in thefirst wafer 100, the temperature of the annealing process is limited torelatively low so as not to damage the electrical components. In someother embodiments, the first wafer 100 and the second wafer 200 may bebonded though a bonding layer formed on the bonding interface of thefirst wafer 100 or on the second wafer 200 before bringing the wafersinto contact.

Referring to FIG. 1D, the stacked wafer structure 300 is flipped upsidedown. After flipping, the second surface 104 of the first wafer 100faces upwardly and the first wafer 100 is carried by the second wafer200 for subsequent processes. The flipping process may be optional insome embodiments.

Referring to FIG. 1E, the first wafer 100 is thinned (i.e. the thicknessof the first wafer 100 is reduced) by performing a mechanical machiningprocess, and the mechanical machining process includes, for example, agrinding process, a chemical mechanical polishing (CMP) process, orother suitable polishing process. In some embodiments, the first wafer100 is thinned from the second surface 104 downward towards the firstsurface 102. For example, during performing the thinning process, thestacked wafer structure 300 is held by a wafer holder (not illustrated).In some embodiments, the first wafer 100 may be thinned until theremained thickness of the first wafer 100 almost equal to or slightlyless than the first thickness Pt1. Since the edge 106 of the first wafer100 is trimmed before performing the wafer thinning process such that anedge-cracking issue due to sharp edges of the thinned wafer can beeliminated.

Referring to FIG. 1F, in some embodiments, the wafer thinning processfurther comprises an etching process. In certain embodiments, the firstwafer 100 is further thinned by performing, for example, a wet etchingprocess. In some embodiments, the wet etching process employshydrofluoric acid/nitric acid/acetic acid (HNA) as the etchant. In someother embodiments, the first wafer 100 is further thinned by performinga dry etching process, and the dry etching process may include areactive ion etching (RIE) process. The etching process at this stagefurther thins the first wafer 100 to a desired thickness Pt2. Forexample, the thickness Pt2 of the first wafer 10 ranges from about 3.8microns to about 4.3 microns. In some embodiments, the wafer thinningprocess includes one or more thin-down processes. The wafer thinningprocess is performed to reduce the thickness of the first wafer 100 onwhich the devices 112 (e.g. image sensors) or other electricalcomponents are formed until it reaches the desired thickness Pt2. Forexample, after performing the thinning processes shown in FIG. 1E andFIG. 1F, the thickness Pt2 of the first wafer 100 is small enough suchthat light can reach the devices 112 or the other electrical components.

After thinning the first wafer 100, a second marking-trimming step isperformed the thinned first wafer 100 with a thickness Pt2. FIG. 3Aillustrates a schematic top view of a stacked wafer structure afterforming a second pre-trimming mark, in accordance with some embodimentsof the present disclosure. FIG. 3B and FIG. 3C illustrate schematicperspective views of a marking-trimming process of a first wafer and asecond wafer, in accordance with some embodiments of the presentdisclosure. FIG. 3D illustrates a schematic enlarged cross-sectionalview of an edge surface in the area D shown in FIG. 3C, in accordancewith some embodiments of the present disclosure. Referring to FIG. 3Athrough FIG. 3C, after thinning the first wafer 100, a secondpre-trimming mark 70 is formed on the second surface 104 of the thinnedfirst wafer 100. In certain embodiments, the second pre-trimming mark 70defines the to-be-removed edge portion in the subsequently trimmingstep, and the to-be-removed portion includes an annular ring TR2 and anannular ring TR3 in FIGS. 3A-3B. In certain embodiments, the annularring TR2 defined between the second pre-trimming mark 70 and the trimmededge 106 a of the first wafer 100 (i.e. the periphery of the first wafer100) has a second width Pw2. In certain embodiments, the annular ringTR3 defined between the second pre-trimming mark 70 and the edge 206 ofthe second wafer 200 (i.e. the periphery of the second wafer 200) has athird width Pw3. In some embodiments, the second pre-trimming mark 70may be formed as a discontinuous pattern or an intermittent pattern onthe second surface 104. In some embodiments, the second pre-trimmingmark 70 includes a plurality of recesses 70 a, and the recesses 70 a areindividual narrow trenches separate from one another. For example, therecesses 70 a is arranged as a circular path along the trimmed edge 106a to form the second pre-trimming mark 70. In some embodiments, formingthe recesses 70 a may use the similar process as forming the recesses 50a and the detailed descriptions are omitted herein.

Each recess 70 a may include a marking depth d2 relative to a referenceplane corresponding to the second surface 104 of the thinned first wafer100. The marking depth d2 of each recess 70 a may range from 1 μm to 35μm, preferably, from 15 μm to 30 μm. In some embodiments, the markingdepth d2 is smaller than the thickness Pt2 of the thinned first wafer100. It is appreciated that the number of the recesses 70 a, the shapeor the size of the recesses 70 a, and the arrangement of the recesses 70a may be modified according to the design requirements of the product.In some embodiments, the intermittent pattern of the second pre-trimmingmark 70 may include individual recesses 70 a separated with one anotherand spaced by a fixed pitch. In some embodiments, any two most adjacentrecesses 70 a are spaced by a pitch P2. For example, the pitch P2between the two most adjacent recesses 70 a may range from 5 μm to 100μm, preferably from 20 μm to 40 μm. In some embodiments, a sum of thepitches P2 along the circular path may be approximately half of a totallength of the circular path. In other words, the recesses 70 a may beevenly distributed on the second surface 104 as a circular path alongthe periphery of the first wafer 100 after performing the firstmarking-trimming step. In some other embodiments, a ratio of the sum ofthe pitches P2 along the circular path to the total length of thecircular path of the second pre-trimming mark 70 ranges from 30% to 80%.It should be noted that the pitch P2 may be modified according to thedimension of the wafer and the design requirements. In alternativeembodiments, the pattern of the second pre-trimming mark 70 may besporadic. In other embodiments, the pattern includes individual recesses70 a separated with one another and spaced with various pitches.

After forming the second pre-trimming mark 70, a second trimming step isperformed to the stacked wafer structure 300. The processes illustratedin FIG. 3A through FIG. 3C may be referred to as the secondmarking-trimming step. For example, during the second trimming step, theannular ring TR2 around the periphery of the first wafer 100 and theannular ring TR3 of the second wafer 200 located under the annular ringTR2 of the first wafer 100 are removed as the stacked wafer structure300 is cut or trimmed right on and along the second pre-trimming mark70. For example, the second trimming step is performed from the secondsurface 104 of the first wafer 100 downward to the second wafer 200along the thickness direction D1 to form the trimmed edge 302 at theperiphery of the stacked wafer structure 300. In some embodiments, thesecond trimming step is performed by the trimming tool 60 cuttingsubstantially vertically or slantedly into the stacked wafer structure300 to a trimming depth (i.e. Pt2+Pt3). That is, during the secondtrimming step, the thinned first wafer 100 with the thickness Pt2 is cutthrough and the second wafer 200 is cut or trimmed to the depth Pt3. Insome embodiments, the second trimming step is carried out by mechanicalmachining which is similar with the first trimming step, and thedetailed descriptions are omitted herein.

During the second marking-trimming step, the removed annular rings TR2may have the second width Pw2 (as defined by the second pre-trimmingmark 70) and the thickness Pt2 (the trimming depth Pt2), and the removedannular ring TR3 may have the third width Pw3 (also defined by thesecond pre-trimming mark 70) and the thickness Pt3 (the trimming depthsPt3). In some embodiments, after removing the annular ring TR2 of thefirst wafer 100 and the annular ring TR3 of the second wafer 200, aring-shaped opening O2 is formed at the periphery of the stacked waferstructure 300 as shown in FIG. 3C. Referring to FIG. 1G, from across-sectional view, the ring-shaped opening O2 looks like L-shaped andthe sidewall of the ring-shaped opening O2 is the trimmed edge 302. Insome embodiments, the trimmed edge 302 is substantially perpendicular tothe second surface 104 of the first wafer 100. In some otherembodiments, the trimmed edge 302 of the stacked wafer structure 300 isslant to the second surface 104. The depth of the opening O2 is thetotal thickness of the second thickness Pt2 and the third thickness Pt3.Since the first wafer 100 has been thinned, the first wafer 100 in thestacked wafer structure 300 may be trimmed over the second thickness Pt2which is less than the first thickness Pt1 during the first trimmingstep.

In some embodiments, the second thickness Pt2 (i.e. the trimming depthPt2) is measured from a reference plane extending from the top surface202 of the second wafer 200 to a reference plane extending from thesecond surface 104 of the first wafer 100. In some embodiments, thesecond width Pw2 is measured from a reference plane extending from thetrimmed edge 106 a to a reference plane extending from the trimmed edge302. The third thickness Pt3 (i.e. the trimming depth Pt3) is measuredfrom the bottom surface 303 (shown in FIG. 1G) of the opening O2 to areference plane extending from the top surface 202 of the second wafer200. In some embodiments, the third width Pw3 is measured from areference plane extending from the edge 206 to a reference planeextending from the trimmed edge 302. In some embodiments that the firstwafer 100 and the second wafer are silicon wafers having a diameter ofabout 12-inch, the third width Pw3 ranges from about 2 mm to about 3 mmor is about 2.6 mm. In some embodiments, a total thickness of the secondthickness Pt2 and the third thickness Pt3 ranges from 20 microns to 30microns or is about 25 microns. For example, the third thickness Pt3 maybe greater than the second thickness Pt2. It should be noted that thedimension of the annular ring TR2 and TR3 may be modified according tothe dimension of the wafer and the design requirements of the product,which is not limited thereto.

Referring to FIG. 3D, after performing the second marking-trimming step,similar with the edge surface of the trimmed edge 106 a shown in FIG.2D, the edge surface of the trimmed edge 302 may have may have aplurality of first regions R3 surrounding by the second regions R4. Insome embodiments, the first regions R3 are formed from the recesses 70 a(FIG. 3B) cutting through during the trimming step. The individual firstregions R3 may be spaced apart from one another by the second region R4surrounding them. Similarly, as the second pre-trimming mark is formedprior to the second trimming step, a smaller main crack portion C1 isformed due to the less localized stress concentration. The texturefeatures TF3 of the first regions R3 is different from the texturefeature TF4 of the second region R4 exhibited on the edge surface of thetrimmed edge 302 of the stacked wafer structure 300, which is describedabove. The detailed descriptions are omitted herein.

Referring to FIG. 1H, after performing the second marking-trimming step,the thickness of the stacked wafer structure 300 may be further reducedby, for example, performing a grinding process, a chemical mechanicalpolishing (CMP) process, or other suitable polishing process. In someembodiments, the first wafer 100 is thinned from the second surface 104along the thickness direction D1 in a state in which the second wafer200 carries the first wafer 100 after the second marking-trimming step.This thinning process brings the first wafer 100 to a desired thicknessT1. For example, the thickness T1 of the first wafer 100 isapproximately 2.6 μm. In some embodiments, cleaning of the stacked waferstructure 300 may be carried out after thinning process by means of wetcleaning with a liquid medium, such as tetramethylammonium hydroxide(TMAH), which may selectively remove the surface contaminants andparticulates without attacking or chemically altering the second surface104 of the first wafer 100. Thereafter, the trimming method of thestacked wafer structure is substantially completed as shown in FIG. 1H.

FIG. 4A illustrates a schematic enlarged cross-sectional view of thearea B indicated in FIG. 1F before performing the second trimming step,in accordance with some embodiments. FIG. 4B illustrates a schematicenlarged cross-sectional view of the area C indicated in FIG. 1H, afterperforming the second trimming step in accordance with some embodiments.Referring to FIG. 4A and FIG. 4B, the first wafer 100 may include abackside alignment mark 140 at the backside under the second surface 104of the first wafer 100. For example, the first wafer 100 and the secondwafer 200 may be aligned by using the backside alignment mark 140 forbetter alignment during bonding the first wafer 100 and the second wafer200. In some embodiments, when the first wafer 100 is thinned, thetrimmed edge 106 a of the first wafer 100 is susceptible to chipping andcracking. In other words, after thinning the first wafer 100 asillustrated in FIG. 1E and/or FIG. 1F, an edge portion 310 may includedefects 110 a presented at the periphery of the stacked wafer structure300. The defects 110 a may be edge peeling defect, cracks, edge chippingdefect or the like. Such defects 110 a may facilitate contaminantincursion during subsequent processes and may damage or destroy thefunctionality of the circuitry layer 120 of the first wafer 100. Thatis, if the edge portion 310 having the defects 310 a is not trimmed off,the manufacturing yield may be adversely affected. Accordingly, thesecond trimming step is performed to trim off the edge portion 310 fromthe stacked wafer structure 300 to from the trimmed edge 302 withoutaffecting the circuitry layer 120, thereby reducing potentialedge-peeling or chipping issue and preventing the loss in themanufacturing yield. For example, by performing the second trimmingstep, the edge-chipping issue may be reduced to 5% to 20% approximatelycompared to the process without performing the second trimming step.

In some embodiments, after thinning the first wafer 100 as shown in FIG.1F, the microscopic protrusions 130 may be presented on the secondsurface 104 which went through thinning. In other words, thinning thefirst wafer 100 (as illustrate in FIG. 1E and FIG. 1F) does notnecessarily planarize or polish the second surface 104 to a high degree.Such microscopic protrusions 130 on the second surface 104 may becritical for the very thin wafer(s). Accordingly, the planarizingprocess, such as CMP, may be performed to remove the microscopicprotrusions 130 to form the substantially planar second surface 104 asshown in FIG. 4B.

Based on the above, since the pre-trimming mark is formed beforetrimming, the contact between the trimming tool and the wafer is reducedon the trimming path, thereby reducing localized stress concentration atthe surface of the wafer. Accordingly, the operation efficiency oftrimming is improved and the damage of the trimming tool may be reducedso as to lengthen the service life thereof. Moreover, by performing thefirst trimming step, the edge cracking issue due to sharp edges of thethinned wafer can be eliminated. In addition, by performing the secondtrimming step, the edge chipping or peeling issue is reduced and alsothe loss in the manufacturing yield is prevented.

According to some embodiments, a trimming method is provided. Thetrimming method includes the following steps. A first wafer having afirst surface and a second surface opposite to the first surface isprovided. A first pre-trimming mark is formed on the first surface ofthe first wafer, wherein forming the first pre-trimming mark comprisesforming a plurality of recesses arranged as a path along a periphery ofthe first wafer. The first wafer is trimmed on the first pre-trimmingmark and along the path of the first pre-trimming mark to remove aportion of the first wafer and form a trimmed edge having first regionsthereon.

According to some alternative embodiments, a trimming method isprovided. The trimming method includes the following steps. A firstwafer having a first surface and a second surface opposite to the firstsurface is provided. A first marking-trimming step is performed to thefirst wafer from the first surface of the first wafer along a thicknessdirection to remove an annular ring around a periphery of the firstwafer. A stacked wafer structure is formed by providing and stacking asecond wafer to the first surface of the first wafer. A secondmarking-trimming step is performed to the stacked wafer structure fromthe second surface of the first wafer along the thickness direction toremove an edge portion of the stacked wafer structure.

According to some alternative embodiments, a wafer structure isprovided. A wafer has a first surface, a second surface opposite to thefirst surface and an edge connecting the first surface and the secondsurface. The edge is substantially perpendicular to the first surfaceand the second surface of the wafer, the edge has first regionssurrounding by a second region, the individual first regions areseparated and spaced from one another by the second region, and atexture feature of the second region is different from texture featuresof the first regions.

According to some alternative embodiments, a trimming method isprovided. The trimming method includes the following steps. A firsttrimming path arranged by a plurality of first trenches spaced from oneanother is formed on a first surface of a first wafer and surrounds aperimeter of the first wafer. A trimming tool is moved along the firsttrimming path to shorten a trimming route on the first surface of thefirst wafer by cutting through the plurality of first trenches.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A trimming method, comprising: providing a firstwafer having a first surface and a second surface opposite to the firstsurface; forming a first pre-trimming mark on the first surface of thefirst wafer, wherein forming the first pre-trimming mark comprisesforming a plurality of recesses arranged as a path along a periphery ofthe first wafer; and trimming the first wafer on the first pre-trimmingmark and along the path of the first pre-trimming mark to remove aportion of the first wafer and form a trimmed edge having first regionsthereon.
 2. The trimming method according to claim 1, wherein formingthe first pre-trimming mark on the first surface of the first wafercomprises: performing an etching process to the first surface of thefirst wafer to form the first pre-trimming mark, wherein the firstregions comprise etching streaks.
 3. The trimming method according toclaim 1, wherein forming the first pre-trimming mark on the firstsurface of the first wafer comprises: performing a laser marking processto the first surface of the first wafer to form the first pre-trimmingmark, wherein the first regions comprise laser marking streaks.
 4. Thetrimming method according to claim 1, wherein trimming the first wafercomprises: cutting into the first wafer and cutting through the firstpre-trimming mark to a trimming depth, wherein the trimming depth islarger than a depth of each of the recesses.
 5. The trimming methodaccording to claim 1, wherein the trimmed edge further comprises asecond region surrounding the first regions, and the second region has atexture feature different from a texture feature of the first regions.6. The trimming method according to claim 1, further comprising:providing a second wafer bonded to the first surface of the first waferafter trimming the first wafer; and performing a wafer thinning processto the second surface of the first wafer.
 7. The trimming methodaccording to claim 6, further comprising: forming a second pre-trimmingmark on the second surface of the first wafer after performing the waferthinning process.
 8. The trimming method according to claim 7, furthercomprising: trimming the first wafer and the second wafer on the secondpre-trimming mark after forming the second pre-trimming mark on thesecond surface of the first wafer.
 9. The trimming method according toclaim 1, wherein trimming the first wafer comprises: reducing a directcontact between a trimming tool and the first wafer by moving thetrimming tool along the path of the first pre-trimming mark.
 10. Atrimming method, comprising: forming a first trimming path arranged by aplurality of first trenches spaced from one another on a first surfaceof a first wafer and surrounding a perimeter of the first wafer; andmoving a trimming tool along the first trimming path to shorten atrimming route on the first surface of the first wafer by cuttingthrough the plurality of first trenches.
 11. The trimming methodaccording to claim 10, wherein forming the first trimming pathcomprises: performing an etching process or a laser marking process onthe first surface of the first wafer to form the plurality of firsttrenches.
 12. The trimming method according to claim 10, wherein movingthe trimming tool along the first trimming path comprises: removing aperipheral portion of the first wafer, wherein after the removing, thefirst wafer comprises a substantially L-shape periphery in across-sectional view.
 13. The trimming method according to claim 10,further comprising: bonding the first surface of the first wafer to asecond wafer and accessibly exposing a second surface of the first waferopposite to the first surface after moving the trimming tool to trim thefirst wafer.
 14. The trimming method according to claim 13, furthercomprising: forming a second trimming path arranged by a plurality ofsecond trenches spaced from one another on the second surface of thefirst wafer; and moving the trimming tool along the second trimming pathto reducing a direct contact between the trimming tool and the firstwafer.
 15. The trimming method according to claim 14, wherein moving thetrimming tool along the second trimming path comprises: moving thetrimming tool from the first wafer to the second wafer to remove aperiphery of the first wafer along with a peripheral portion of thesecond wafer, wherein after the removing, the second wafer comprises asubstantially L-shape periphery in a cross-sectional view.
 16. A waferstructure, comprising: a wafer comprising a first surface, a secondsurface opposite to the first surface, and an edge connecting the firstsurface and the second surface, wherein the edge is substantiallyperpendicular to the first surface and the second surface of the wafer,the edge has first regions surrounding by a second region, theindividual first regions are separated and spaced apart from one anotherby the second region, and a texture feature of the second region isdifferent from texture features of the first regions.
 17. The waferstructure according to claim 16, wherein the texture features of thefirst regions comprise streaks extending in the first regions in athickness direction of the wafer.
 18. The wafer structure according toclaim 16, wherein the texture feature of the second region comprises amain crack portion and a median crack portion by the main crack portion,the main crack portion is smaller than the median crack portion.
 19. Thewafer structure according to claim 18, wherein a plurality of curvingstreaks substantially parallel with one another are distributed on asurface within the median crack portion.
 20. The wafer structureaccording to claim 16, wherein a first portion of the first regions isdistributed on a side connected to the first surface, and a secondportion of the first regions is distributed on a side connected to thesecond surface.